Description
New-user Friendly & Easy to Print
Bambu PLA Basic is designed to be extremely user-friendly, making it an ideal choice for beginners or those new to 3D printing. What’s more, PLA Basic enables users to achieve high-quality prints consistently, without the need for extensive adjustments or advanced printing settings.
High-printing Quality
Bambu Lab’s PLA filament stands out for its high print speed, and excellent appearance. Experience the benefits of smooth and flawless prints with superior quality that exceeds expectations.
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System). Load and print! No more tedious setting steps.
Accessory Compatibility
| Recommended | Not Recommended | |
|---|---|---|
| Build Plate | Cool Plate, High Temperature Plate or Textured PEI Plate | Engineering Plate |
| Hotend | All Size / Material | / |
| Glue | Bambu Liquid Glue Glue Stick |
/ |
Accessory Compatibility
| Recommended Printing Settings | |
| Drying Settings (Blast Drying Oven) | 55 °C，8 h |
| Printing and Keeping Container’s Humidity | < 20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 190 – 230 °C |
| Bed Temperature (with Glue) | 35 – 45 °C |
| Printing Speed | < 300 mm/s |
| Physical Properties | |
| Density | 1.24 g/cm³ |
| Vicat Softening Temperature | 57 °C |
| Heat Deflection Temperature | 57 °C |
| Melting Temperature | 160 °C |
| Melt Index | 42.4 ± 3.5 g/10 min |
| Mechanical Properties | |
| Tensile Strength | 35 ± 4 MPa |
| Breaking Elongation Rate | 12.2 ± 1.8 % |
| Bending Modulus | 2750 ± 160 MPa |
| Bending Strength | 76 ± 5 MPa |
| Impact Strength | 26.6 ± 2.8 kJ/m² |
Printing Tips
- For better print results, please reduce the Max volumetric speed from 21 mm³/s to 15 mm³/s when printing PLA Basic Silver/Gold/Bronze.
- Drying conditions: 55℃ for 8 hrs. Store in a dry environment after use. Dry before use if the material absorbs moisture. For more details please refer to: Filament drying instructions on WIKI.
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